The 4th Technion-Intel Challenge (2018)

The 4th Technion-Intel Challenge (2018)

Date:
Sunday, 19.3.2017, 13:30
Place:
EE Meyer Building 1003

The 4th Technion-Intel Challenge invites you to challenge the next generation depth sensing technologies (3D cameras), deep learning techniques and IoT devices, and to the opportunity to early access to the latest Intel products and to take part in shaping the future of robotics, drones, autonomous navigation, smart homes, scene understanding, VR/AR/MR, HMI, deep learning, and more.

The event will take place on Sunday, March 19, 2017, 13:00-15:00, in Room 1003, EE Meyer Building and will offer demos, trending technologies, mingling and refreshments.

More details.

You are all invited!

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