The Taub Faculty of Computer Science Events and Talks

For over 4 decades, the gap between computer processing speed and memory access has grown at about 50% per year, to more than 1,000x today. This provides an excellent opportunity to enhance the single-core system performance. An innovative 3D integration technology combined with re-architecting the integrated memory device is proposed to bridge the gap and enable a 1,000 x improvement in computer systems. The proposed technology utilizes processes that are widely available and could be integrated in products within a very short time.

Bio:
Or-Bach is the world recognized expert in monolithic 3D technologies with over 100 patents in the space, the chairman of the 3D of IEEE S3S Conference, and is active as an invited speaker and tutorial instructor in the US, Korea, and Japan. He has extensive management experience including being CEO and in charge of R&D, sales, marketing, business development and other corporate functions for over 40 years. Or-Bach has been an active board member of technology companies for over 20 years and is currently Chairman of the Board for Zeno Semiconductors and VisuMenu. Or-Bach has a history of innovative development in fast-turn ASICs for over 20 years. His vision led to the invention of the first Structured ASIC architecture, the first single via programmable array, and the first laser-based system for oneday Gate Array customization. Prior to MonolithIC 3D, Or-Bach founded eASIC in 1999 and served as the company's CEO for six years. eASIC was funded by leading investors Vinod Khosla and KPCB in three successive rounds. Under Or-Bach's leadership, eASIC won the prestigious EETimes' 2005 ACE Award for Ultimate Product of the year in the Logic and Programmable Logic category and the Innovator of the Year Award and was selected by EE Times to be part of the “Disruptors”–“The people, products and technologies that are changing the way we live, work and play.” Earlier, Or-Bach founded Chip Express in 1989 (recently acquired by Gigoptix) and served as the company's president and CEO for almost 10 years, bringing the company to $40M revenue and recognition for four consecutive years as a high-tech Fast 50 Company. Zvi Or-Bach received his BSc degree (1975) cum laude in electrical engineering from the Technion – Israel Institute of Technology, and MSc (1979) with distinction in computer science, from the Weizmann Institute, Israel. He holds over 180 issued patents, primarily in the field of 3D integrated circuits and semi-custom chip architectures.